3D Modelling and Simulation of Fast Fuses for Power Semiconductors

A. Pleşca (Romania)


3D model, fast fuse and temperature distribution


It is important to know the thermal behaviour of a fast fuse for an optimized design as well as for a right choice of the fuse rating with the aim to protect the power semiconductor. A 3D thermal model was developed in order to study the temperature distribution at a fast fuse. In this model the thermal behaviour of the fast fuse depends on the design of the fuselink elements, the material parameters and the ambient conditions. It was shown the temperature distribution through all fuselink elements. The simulated temperatures were compared with measured temperatures at defined points on the fuse.

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