Carbon Nanotube-Assisted Microwave Thermal Bonding of Plastic Biochip

J.L.P. Wong, T.M.H. Lee, and K.L. Yung (PRC)

Keywords

Microtechnology and bioMEMS; Carbon nanotubes;Polymeric bonding; Biochip

Abstract

A sealed plate is essential for protecting the sample processing inside biochip from the environment and it can be attained through bonding. Bonding technology in silicon and glass are well-developed in the past decades; however, bonding in polymers is still challenging. Issues such as micropattern integrity, contamination and bonding efficiency are important criteria for plastic bonding. In this work, a new bonding method combining the advantages of thermal bonding (homogeneous bonding) and microwave bonding (high fusion efficiency and low energy consumption) has been developed which allows the biochip manufacturing to be more scalable. It features with simple equipment setup, low material and running costs. Given the strong dielectric properties [1-4], carbon nanotubes (CNTs) were used as effective microwave absorber in this bonding system. A desirable bonding result has been obtained as shown in this paper.

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