D. Thompson, J. Lee, S. Pinel, K. Lim, G. DeJean, R. Li, M. Tentzeris, and J. Laskar (USA)
Soft and hard surfaces (SHS), patch antennas, cavity resonator filters, high-Q passives, multilayer integration
This paper reviews the development of advanced System on-Package (SOP) architectures for compact and low cost wireless RF wireless systems. A miniaturized stacked patch antenna adopting soft-and-hard surface structures (SHS) in LTCC and cavity resonator filters in Liquid Crystal Polymer (LCP) using inter-resonance coupling mechanism for V-band applications are presented. In addition, the high Q-factor inductors fabricated on the LCP-based multi-layer substrate demonstrate superior performance than conventional organic packages.
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