Dynamic Modeling and Vibration Analysis of Airborne Electronic Cases

Fei Xu, Chuanri Li, Xiaoxi Guo, and Tongmin Jiang


FEA model, ANSYS, printed circuit boards, airborne electronic cases


Previous articles studied the reliability of electronic equipment subjected to shock and vibration by analyzing PCBs separately. But in some equipment, i.e., the airborne electronic cases (AECs), printed circuit boards (PCBs) are connected to the motherboard. Analyzing these PCBs separately will lead to large error, since the influence of the motherboard on these PCBs is unnegligible. In this paper, a procedure is presented to handle such a situation by an example of vibration analysis of an AEC. In this procedure, both finite element modeling (FEM) and experimental techniques are employed. A finite element analysis (FEA) model of the AEC is first established with the use of ANSYS based on design specifications. Since all PCBs except the motherboard in this AEC are modeled with the same modeling approach and have similar boundary conditions (BCs), one PCB model, instead of all PCBs, is then analyzed correlated with the modal test data. Finally, random vibration analysis of the AEC is presented, response of three specific points on the PCB is measured, and a comparison between simulation and experimental results is conducted and a reasonable correlation is obtained.

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